Hot Sales HDI Multilayer FR4 PCB Potoloho Boards Bakeng sa Micro SD Card
Lintlha tse Potlakileng:
Botenya ba Koporo: 1 oz
Botenya ba Boto: 1.0mm
Min.Boholo ba lesoba: 0.20mm
Min.Bophara ba Mola: 0.075mm
Min.Sebaka sa Mohala:0.075mm
Qetello ea Bokaholimo: ENIG
Boto ea Boto: E khethiloe
'Mala oa mask oa solder:Enke e tala
Mamello ea Botenya ba Boto:+/-10%
V-cut angle:25°,30°,45°,60°
Sotha & Qhala:≤ 0.5%
File: Pro tel 99se/P-CAD/Auto cad/Cam350
Ho paka ka hare: Pakete ea vacuum, mokotla oa polasetiki
Ho paka ka ntle: Ho paka mabokose a tloaelehileng
Tšebeletso: PCB & PCBA
Lera:6 lera
Silk mask: E tšoeu
Tlhaloso ea Lihlahisoa
1 | Tlhaloso | Setšoantšo sa PCB |
2 | Lintho tse bonahalang | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminium |
3 | Lera | 1-20 |
4 | Botenya ba Boto | 0.2mm-4.0mm |
5 | Mamello ea Botenya ba Boto | +/-10% |
6 | Botenya ba koporo | 17.5um-175um (0.5oz-5oz) |
7 | Min Trace Width | 0.15 limilimithara |
8 | Min Space Width | 0.15 limilimithara |
9 | Min Drilling Dia | 0.2 limilimithara |
10 | PTH botenya ba koporo | 0.4-2mil(10-50um) |
11 | Mamello ea Etching | ±1mil(±25um) |
12 | V-cut angle | 25°,30°,45°,60° |
13 | Pearl Matla a line | ≥ 6lb/in(≥ 107g/mm) |
14 | Taolo ea impedance le mamello | 50Ω±10% |
15 | Sotha & Qhala | ≤ 0.5% |
16 | Mask ea solder | Botala, Bofubedu, Boputswa, Bosweu, Botsho, Bosehla |
17 | Qetello ea Bokaholimo/ Ho pola | HASL/Lead Free HASL/OSP/Gold Plating/Emmersion Gold/ENIG |
18 | Setifikeiti | ROSH.ISO9001 |
19 | Faele | Protel 99se/P-CAD/Auto cad/Cam350 |
20 | Ho paka ka hare | Ho paka ka vacuum, mokotla oa polasetiki |
21 | Ho paka ka ntle | Ho paka mabokose a tloaelehileng |
Feme ea rona:
Ngola molaetsa wa hao mona mme o re romele wona