FR4 Bokhoni:
| Ntho | Litlhaloso tsa Tekheniki |
|---|---|
| Mofuta oa Boitsebiso | FR-1, FR-4, CEM-1, CEM-3, Rogers, ISOLA |
| Botenya ba Lintho | 0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005" |
| Palo ea lera | Likarolo tse 1 ho isa ho tse 20 |
| Max.Boto ea Boto | 22.00" x 28.00" |
| Sehlopha sa IPC | Sehlopha sa II, Sehlopha sa III |
| Ring ea Annular | 5 mil/lehlakore kapa ho feta (Moqapi o Min.) |
| Qetella ho Plating | Solder(HASL), Lead Free Solder(L/F HASL), ENIG (Electroless Nickel Immersion Gold), OSP, Silivera ea ho qoelisoa, Tin ea ho qoelisoa, Nickel ea qoelisoa, Khauta e Thata, joalo-joalo. |
| Boima ba Koporo | Kantle : Ho fihla ho 7oz, ka hare : ho fihla ho 4 oz. |
| Trace/ Bophara ba Sebaka | 3/3 mil |
| Boholo ba pad e nyane | 12 mil |
| Slots Plated | 0.016“ |
| Sekoti se senyenyane | 8mil;4 mil |
| Menoana ea Khauta | 1 ho isa ho 4 Edge (30 ho isa ho 50 Micron Gold) |
| Sekhahla sa SMD | 0.080”- 0.020”- 0.010” |
| Mofuta oa Soldermask | LPI e benyang, LPI-Matte |
| Mobala oa Soldermask | Botala, Bofubedu, Boputswa, Botsho, Bosweu, Bosehla, Le hlakile |
| 'Mala oa Legend | White, Yellow, Black, Red, Blue. |
| Bonyane Bophara ba Tsela | 0.031" |
| Lintlha (v-cut) | Straight Lines, Jump Scoring, CNC V-CUT. |
| Khauta | HARD, SOFT, IMMERSION (ho fihla ho 50 MICRON GOLD) |
| Data File Format | Gerber RS-274x e nang le lesoba la embedder. |
| Fab.Sebopeho sa ho taka | Lifaele tsa Gerber, DXF, DWG, PDF |
| Aspect ratio | 10:01 |
| Counter Sink / Counter Bore | Ee |
| Laola Impedence | Ee |
| Litsela tsa Bofofu / Tse Patoang | Ee |
| Mask e Peelable | Ee |
| Khabone | Ee |
Bokhoni ba MC PCB:
| Ntho | Litlhaloso tsa Tekheniki |
|---|---|
| Palo ea lihlopha | Lehlakore le le leng, Mahlakore a Habeli, Mekhahlelo e Mene ea MCPCB |
| Mofuta oa sehlahisoa | Aluminium, Copper, Iron base MCPCB |
| Mofani oa laminate | Berquist, Ventec, Polytronics, Boyu, Wazam joalo-joalo. |
| Qetella boto botenya | 0.2 ~ 5.0 limilimithara |
| Botenya ba koporo | Hoz-3oz |
| Mofani oa mask a solder | Taiyo, Fotochem joalo-joalo. |
| 'Mala oa mask oa solder | Bosoeu, Botsho, Bokhubelu, Botala, Bosehla joalo-joalo. |
| Qetello ea bokaholimo | L/F HASL, OSP, ENIG, Electrolytic Silivera, Tin ea ho qoelisoa, Silivera ea ho qoelisoa joalo-joalo. |
| Mofuta oa kemiso e phethiloeng | Ho tsamaisa, Ho phunya, V-cut |
| Inamela le ho sotha | ≤0.75% |
| Min hole boholo | 1.0 limilimithara |
| Max.boholo ba boto | 1500mmX610mm |
| Min.boholo ba boto | 10mmX10mm |