Sink PAD

  • Thermal management Printed Circuit Board (PCB)-SinkPAD TM

    Tsamaiso ea mocheso Printed Circuit Board (PCB)-SinkPAD TM

    SinkPAD ketsamaiso ea mocheso Printed Circuit Board (PCB) thekenolojie etsang hore ho khonehe ho tsamaisa mocheso ho tsoa ho LED le ho ea sepakapakeng ka potlako le ka mokhoa o atlehileng ho feta MCPCB e tloaelehileng.SinkPAD e fana ka ts'ebetso e phahameng ea mocheso bakeng sa li-LED tse mahareng ho isa ho tse phahameng.

  • Low-cost Aluminum core laminated copper foil SinkPAD PCB

    Theko e tlaase ea Aluminium core laminated koporo foil SinkPAD PCB

    Thermoelectric Separation Substrate ke eng?
    Likarolo tsa potoloho le pente ea mocheso holim'a substrate li arohane, 'me setsi sa mocheso sa likarolo tsa mocheso se kopana ka ho toba le mocheso o tsamaisang mocheso ho finyella phello e ntle ea mocheso oa mocheso (zero thermal resistance).Thepa ea substrate ka kakaretso ke tšepe (Koporo) substrate.
  • Direct thermal path MCPCB and Sink-pad MCPCB, Copper Core PCB, Copper PCB

    Tsela e tobileng ea mocheso MCPCB le Sink-pad MCPCB, Copper Core PCB, Copper PCB

    Lintlha tsa Sehlahisoa Boitsebiso ba Motheo: Alu/ Koporo Botenya ba Koporo: 0.5/1/2/3/4 OZ Botenya ba Boto: 0.6-5mm Min.Bophara ba lesoba: T/2mm Min.Bophara ba Mola: 0.15mm Min.Line Spacing:0.15mm Surface Finishing:HASL,Immersion gold,Flash gold, plated plated,OSP Lebitso la ntho:MCPCB LED PCB Printed circuit board,Aluminium PCB,copper core PCB V-cut Angle:30°,45°,60°Shape mamello:+/-0.1mm Hole le DIA mamello:+/-0.1mm Thermal Conductivity: 0.8-3 W/MK E-test voltage: 50-250V Peel-off Matla: 2.2N/mm Warp kapa sotha: