Moetsi oa boto ea potoloho ea SMT tloaelo kopano ea elektronike PCB
Lintlha tsa Sehlahisoa
Nomoro ea mohlala: kopano ea elektronike PCB PCBA
Mofuta: PCBA ea lisebelisoa tsa elektroniki
Sebaka sa Tšimoloho: Guangdong, Chaena
Mofuta oa barekisi: PCB
Setifikeiti: ISO9001 2015, TUV SUD
Mofuta oa PCB: E thata, e tenyetseha, e thata-ea tenyetseha
Tšebeletso: PCB/PCBA/DIP/Component reka
Tšebeletso e 'ngoe:Moetso oa PCBA le sebopeho
Tšebeletso ea teko:AOI/X-RAY/Teko ea tšebetso
Botenya ba Koporo: 0.5 OZ-3OZ (18 um-385 um)
Boitsebiso ba Motheo: FR-4;Phahameng TG FR-4;Aluminium;CEM-1;CEM-3;
Botenya ba Boto: 0.2mm-4mm
Qetello ea Bokahohle: HASL, LF HASL, IMM Gold, IMM Silver, OSP joalo-joalo
Lebitso la sehlahisoa: Tloaelo ea moetsi oa boto ea potoloho ea SMT
Lihlahisoa Bokhoni
| Lintho | Matla a PCBA |
| Lebitso la sehlahisoa | Moetsi oa boto ea potoloho ea SMT tloaelo kopano ea elektronike PCB |
| Lintlha tsa kopano | SMT le Thru-hole, ISO SMT le DIP mela |
| Ho hlahloba lihlahisoa | Teko ea jig / hlobo, Tlhahlobo ea X-ray, Tlhahlobo ea AOI, Teko e sebetsang |
| Bongata | Palo e nyane: 1pcs.Prototype, taelo e nyane, tatellano ea bongata, tsohle li lokile |
| Lifaele tse hlokahalang | PCB: Lifaele tsa Gerber (CAM, PCB, PCBDOC) |
| Likaroloana: Bili ea Lisebelisoa (Lethathamo la BOM) | |
| Kopano : Faele ea Khetha-N-Sebaka | |
| PCB Panel boholo | Boholo bo fokolang: 0.25 * 0.25 inch (6 * 6mm) |
| Boholo ba boholo: 1200 * 600mm | |
| Lintlha tsa likarolo | Phahamisa ho ea ho 0201 boholo |
| BGA le VFBGA | |
| Etella pele ka tlase ho li-Chip Carriers/CSP | |
| Kopano ea SMT e mahlakoreng a mabeli | |
| Sekhahla se setle sa BGA ho isa ho 0.2mm(8mil) | |
| BGA Tokiso le Re-Ball | |
| Ho Tlosoa ha Karolo le Phetoho | |
| Sephutheloana sa likarolo | Seha Tape, Tube, Reels, Likarolo tse Lokolohileng |
| Mokhoa oa ho kopanya PCB + | Ho cheka-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Tekolo ea Motlakase-----SMT-----Wave Soldering ----- --Ho Kopanya-----ICT-----Teko ya Tshebetso-----Mocheso le Mongobo |
| Lintho | Matla a PCB |
| Lebitso la sehlahisoa | Moetsi oa boto ea potoloho ea SMT tloaelo kopano ea elektronike PCB |
| Lintho tse bonahalang | FR-4;Phahameng TG FR-4;Aluminium;CEM-1;CEM-3;Rogers, joalo-joalo |
| Mofuta oa PCB | E thata, e tenyetseha, e thata-fetoha |
| Lera NO. | 1, 2, 4, 6, ho fihla ho 24 lera |
| Sebopeho | Rectangular, chitja, slots, cutouts, rarahaneng, irregular |
| Boholo ba litekanyo tsa PCB | 1200mm * 600mm |
| Botenya ba Boto | 0.2mm-4mm |
| Botenya Mamello | ±10% |
| Min Hole Size | 0.1mm (4 mil) |
| Botenya ba Koporo | 0.5 OZ-3OZ (18 um-385 um) |
| Koporo Plating lesoba | 18um-30um |
| Min Trace Width | 0.075mm (3mil) |
| Min Space Width | 0.1mm (4 mil) |
| Qetello ea bokaholimo | HASL, LF HASL, IMM Khauta, IMM Silver, OSP joalo-joalo |
| Mask ea solder | Botala, bofubelu, bosoeu, bosehla, boputsoa, botšo, lamunu, pherese |
Boleng le Leano :
1.Ka ho tsoelang pele ho ntlafatsa boleng ba rona, katleho, tšebeletso ho khotsofatsa tlhoko ea moreki.
Litlhaloso tsa Boleng:
Sistimi ea Boleng:
1.ISO-9001: 2018 Quality System Standard
2. Boemo ba Boleng: IPC-610-D sehlopha sa 2,
3. Tekanyetso ea Soldering: J-STD-001 sehlopha sa 1,2,3
4. Tekanyetso ea ESD: ESD-MIL-STD-1686
5. Tsamaiso ea lithupelo:5S
6. Tlhahlobo ea sehlooho ea FAI-ea pele
7. Ts'ebetso ea tlhahlobo ea pono
8. Tlhahlobo ea AOI
9. Tekanyo ea mochine le tlhokomelo ea thibelo
10. Tsamaiso ea thepa ea ERP le ts'ebetso (ERP=sistimi ea komporo ea moralo oa lisebelisoa tsa khoebo)
Litekanyetso tsa boleng
IPC-A-610D-G
Tsamaiso ea ROHS
E lumellana le sehlahisoa: ROHS
Lenane la lintho tse hanetsoeng tsa ROHS:
NO.Lebitso Moeli o kaholimo(ppm=mg/kg)
1 Pb 0.1%(1000ppm)
2 Hg 0.1%(1000ppm)
3 Cd 0.001%(100ppm)
4 Cr VI+ 0.1%(1000ppm)
5 PBB 0.1%(1000ppm)
6 PBDE 0.1%(1000ppm)
