Shenzhen boleng bo holimo ba aluminium PCB MCPCB le Taiyo PSR-4000 letoto le hloekileng tšoeu solder maske

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Product Qaqileng

Bokhoni ba ho etsa thepa: 

ntho Proizvodnje bokgoni
Boitsebiso FR4, CEM-1, Aluminium, poly mag amide
Lera No. 1-12
O qetile boto botenya 0.1 limilimithara-4.0mm
Mamello ea botenya Board ± 10%
Botenya ba Cooper 0.5 OZ-3OZ (18 um-385 um)
Koporo Plating Hole 18-40 um
Taolo ea Impedance ± 10%
Koba & sotha 0.70%
Peel e khona 0.012 "(0.3mm) -0.02 '(0.5mm)

Litšoantšo

Min Trace Bophara (a) 0.075mm (3mil)
Bolelele ba Sebaka sa Min (b) 0.1mm (4 mil)
Min Annular Ring 0.1mm (4 mil)
Sekoti sa SMD (a) 0.2 limilimithara (8 mil)
Sekhahla sa BGA (b) 0.2 limilimithara (8 mil)

Solder Mask

Letamo la Min Solder Mask (a) 0.0635 limilimithara (2.5mil)
Solder mask clearance (b) 0.1mm (4 mil)
Metsotsoana ea SMT Pad (c) 0.1mm (4 mil)
Solder Mask botenya 0.0007 "(0.018mm)

Likoti

Mets Hole boholo (CNC) 0.2 limilimithara (8 mil)
Min Punch Hole Boholo 0.9 limilimithara (35 mil)
Boholo ba Hole TOL (+/-) PTH: ± 0.075mm; NPTH: ± 0.05mm
Boemo ba Hole TOL ± 0.075mm

Ho roala

HASL 2.5um
Etella pele mahala HASL 2.5um
Ho qoelisoa Khauta Nikele 3-7um Au: 1-5u ''
OSP 0.2-0.5um

Kemiso

Kemiso ea Kakaretso ea TOL (+/-) CNC: ± 0.125mm, ho otla ka litebele: ± 0.15mm
Ho hlahisa 30 ° 45 °
Sekhutlo sa Monoana oa Khauta 15 ° 30 ° 45 ° 60 °
Lengolo  ROHS, ISO9001: 2008, SGS, lengolo la UL

Re ka u etsetsa:

1-12 lera FR4 PCB.

1-2layer aluminium PCB.

1-4layer tenyetsehang PCB.

CEM-1 PCB

94VO PCB

Tšebeletso ea kopano ea SMT le DIP.

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