Shenzhen aluminium ea boleng bo holimo PCB MCPCB e nang le Taiyo PSR-4000 letoto la maske a hloekileng a solder a tšoeu
Bokhoni ba Tlhahiso:
ntho | Bokhoni ba ho Etsa |
Lintho tse bonahalang | FR4, CEM-1, Aluminium, Poly amide |
Lera No. | 1-12 |
E felile boto botenya | 0.1 mm-4.0mm |
Mamello ea Botenya ba Boto | ±10% |
Botenya ba Cooper | 0.5 OZ-3OZ (18 um-385 um) |
Sekoti sa Koporo | 18-40 dim |
Taolo ea Impedans | ±10% |
Warp & Twist | 0.70% |
Peel ka khona | 0.012"(0.3mm)-0.02'(0.5mm) |
Litšoantšo
Min Trace Width (a) | 0.075mm (3mil) |
Min Space Width (b) | 0.1mm (4 mil) |
Min Annular Ring | 0.1mm (4 mil) |
SMD Pitch (a) | 0.2 limilimithara(8 mil) |
BGA Pitch (b) | 0.2 limilimithara (8 mil) |
Mask ea solder
Letamo la Mask la Min Solder (a) | 0.0635 limilimithara (2.5mil) |
Ho hlakola mask a solder (b) | 0.1mm (4 mil) |
Sekheo se senyenyane sa SMT Pad (c) | 0.1mm (4 mil) |
Solder Mask Botenya | 0.0007"(0.018mm) |
Likoti
Min Hole size (CNC) | 0.2 limilimithara (8 mil) |
Min Punch Hole Size | 0.9 limilimithara (35 mil) |
Hole Size TOL (+/-) | PTH: ±0.075mm;NPTH: ±0.05mm |
Hole Position TOL | ± 0.075mm |
Ho roala
HASL | 2.5um |
Keta HASL mahala | 2.5um |
Khauta e Kentsoeng | Nickel 3-7um Au:1-5u'' |
OSP | 0.2-0.5um |
Kemiso
Phanele Outline TOL (+/-) | CNC: ± 0.125mm, Ho phunya: ± 0.15mm |
Beveling | 30°45° |
Khauta monoana angle | 15° 30° 45° 60° |
Setifikeiti | ROHS, ISO9001:2008, SGS, setifikeiti sa UL |
Re ka u etsetsa:
1-12 lera FR4 PCB.
1-2 lera aluminium PCB.
1-4 lera PCB e tenyetsehang.
CEM-1 PCB
94VO PCB
Tšebeletso ea kopano ea SMT le DIP.
Ngola molaetsa wa hao mona mme o re romele wona