Shenzhen aluminium ea boleng bo holimo PCB MCPCB e nang le Taiyo PSR-4000 letoto la maske a hloekileng a solder a tšoeu


Lintlha tsa Sehlahisoa

Bokhoni ba Tlhahiso:

ntho Bokhoni ba ho Etsa
Lintho tse bonahalang FR4, CEM-1, Aluminium, Poly amide
Lera No. 1-12
E felile boto botenya 0.1 mm-4.0mm
Mamello ea Botenya ba Boto ±10%
Botenya ba Cooper 0.5 OZ-3OZ (18 um-385 um)
Sekoti sa Koporo 18-40 dim
Taolo ea Impedans ±10%
Warp & Twist 0.70%
Peel ka khona 0.012"(0.3mm)-0.02'(0.5mm)

Litšoantšo

Min Trace Width (a) 0.075mm (3mil)
Min Space Width (b) 0.1mm (4 mil)
Min Annular Ring 0.1mm (4 mil)
SMD Pitch (a) 0.2 limilimithara(8 mil)
BGA Pitch (b) 0.2 limilimithara (8 mil)

Mask ea solder

Letamo la Mask la Min Solder (a) 0.0635 limilimithara (2.5mil)
Ho hlakola mask a solder (b) 0.1mm (4 mil)
Sekheo se senyenyane sa SMT Pad (c) 0.1mm (4 mil)
Solder Mask Botenya 0.0007"(0.018mm)

Likoti

Min Hole size (CNC) 0.2 limilimithara (8 mil)
Min Punch Hole Size 0.9 limilimithara (35 mil)
Hole Size TOL (+/-) PTH: ±0.075mm;NPTH: ±0.05mm
Hole Position TOL ± 0.075mm

Ho roala

HASL 2.5um
Keta HASL mahala 2.5um
Khauta e Kentsoeng Nickel 3-7um Au:1-5u''
OSP 0.2-0.5um

Kemiso

Phanele Outline TOL (+/-) CNC: ± 0.125mm, Ho phunya: ± 0.15mm
Beveling 30°45°
Khauta monoana angle 15° 30° 45° 60°
Setifikeiti ROHS, ISO9001:2008, SGS, setifikeiti sa UL

Re ka u etsetsa:

1-12 lera FR4 PCB.

1-2 lera aluminium PCB.

1-4 lera PCB e tenyetsehang.

CEM-1 PCB

94VO PCB

Tšebeletso ea kopano ea SMT le DIP.

3
5

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  • E 'ngoe:

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