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Tsela e tobileng ea mocheso MCPCB le Sink-pad MCPCB, Copper Core PCB, Copper PCB
Lintlha tsa Sehlahisoa Boitsebiso ba Motheo: Alu/ Koporo Botenya ba Koporo: 0.5/1/2/3/4 OZ Botenya ba Boto: 0.6-5mm Min.Bophara ba lesoba: T/2mm Min.Bophara ba Mola: 0.15mm Min.Line Spacing:0.15mm Surface Finishing:HASL,Immersion gold,Flash gold, plated plated,OSP Lebitso la ntho:MCPCB LED PCB Printed circuit board,Aluminium PCB,copper core PCB V-cut Angle:30°,45°,60°Shape mamello:+/-0.1mm Hole le DIA mamello:+/-0.1mm Thermal Conductivity: 0.8-3 W/MK E-test voltage: 50-250V Peel-off Matla: 2.2N/mm Warp kapa sotha: -
10-Likarolo PCB ea koporo e boima
* Lipalo tsa Layer: 10 layers * Botenya ba boto bo felileng (0.2-6.0mm): 2.0mm * Botenya ba koporo ea motheo: 1 oz * Botenya ba koporo bo felileng: 4 oz * Mamello ea boholo ba dimension (± 0.1mm) * Phekolo ea Bokaholimo: ENIG * Taolo ea Impedans: E Kaho ea potoloho e boima ea koporo e fana ka boto ka melemo e kang: Keketseho ea mamello ho mefuta ea mocheso.Matla a ntseng a eketseha a ho jara.Keketseho ea matla a mochini libakeng tsa likhokahanyo le likoting tsa PTH.Tšebeliso ea lisebelisoa tse sa tloaelehang ho fihlela litlhoko tsa bona ... -
36W PCB Ka Sensor Ceiling Fan Board
Lintlha tse Potlakileng:
Mofuta: PCB e thata
Lintho tsa motheo: FR4 TG130
Botenya ba Koporo: 1OZ/2OZ
Botenya ba Boto: 1mm
Min.Boholo ba lesoba: 0.01mm
Min.Bophara ba Mola: 0.02mm
Min.Sebaka sa Mohala:0.01mm
Qetello ea Bokaholimo:HASL
Boto ea Boto: E khethiloe
Mocheso o sebetsang: -5 ℃-60 ℃
Palo ea mekhahlelo: Mekhahlelo e habeli
Mocheso oa polokelo: -20 ℃-80 ℃
E lekantsoe matla a sebetsang: AC100V-250V
'Mala oa mask oa solder:Black.Red.Yellow.White.Blue.Green.Tala
PCB Standard:IPC-A-610 E
Bokhoni ba SMT:BGA.QFP.SOP.QFN.PLCC.CHIP
Teko ea Kopano ea PCB: Tlhahlobo ea Pono (ea kamehla), AOI, FCT, X-RAY
Lisebelisoa tsa Substrates:Aluminium, 22F,CEM-1,CEM-3,FR4
Matla a ho senya: 2.0-2.4KV(AC)
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Shenzhen aluminium PCB fektheri SMD boleng MCPCB 5630 LED PCB moetsi
Tlhaloso ea Sehlahisoa Bokhoni ba rona ba tlhahiso PCB Item Manufacture Layer Counts 1–20L Base Material FR4,High-TG FR4,CEM3,aluminium,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) Material Thickness(mm) 0.40, 0.60,0.80 , 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 Max boto saese(mm) 1200x400mm Boto ea Outline Tolerance ±0.15mm Botenya ba Boto 0.4mm–3.2mm Botenya Mamello ± 8% Minnumline -
Ho rarahana ho phahameng HDI PCB bakeng sa sehlahisoa sa indasteri.
Litlhaloso / Likarolo tse Khethehileng: Boitsebiso: FR4 TG180 Palo ea Layer: 6 layers Botenya ba Boto: 1.6mm Botenya ba Koporo: 1oz Bonyane Bonyane ba ho Cheka Bongata: 0.1mm Bonyane ba Tsela le Lekhalo: 0.1mm Surface Qetella: Theknoloji e Immersion Gold e Khethehileng: Lisebelisoa tsa Sehlahisoa sa Blind Via: Melemo: Ha ho MOQ E sebetsang lisampole tsa mahala Phetoho e potlakileng le ho tsamaisoa ka nako Litšebeletso tse kholo tsa bareki pele le morao Lits'ebeletso tsa PCB tse amohetsoeng ke UL -
Hot Sales HDI Multilayer FR4 PCB Potoloho Boards Bakeng sa Micro SD Card
Lintlha tse Potlakileng:
Botenya ba Koporo: 1 oz
Botenya ba Boto: 1.0mm
Min.Boholo ba lesoba: 0.20mm
Min.Bophara ba Mola: 0.075mm
Min.Sebaka sa Mohala:0.075mm
Qetello ea Bokaholimo: ENIG
Boto ea Boto: E khethiloe
'Mala oa mask oa solder:Enke e tala
Mamello ea Botenya ba Boto:+/-10%
V-cut angle:25°,30°,45°,60°
Sotha & Qhala:≤ 0.5%
File: Pro tel 99se/P-CAD/Auto cad/Cam350
Ho paka ka hare: Pakete ea vacuum, mokotla oa polasetiki
Ho paka ka ntle: Ho paka mabokose a tloaelehileng
Tšebeletso: PCB & PCBA
Lera:6 lera
Silk mask: E tšoeu
