Low-cost Aluminum core laminated copper foil SinkPAD PCB Featured Image

Theko e tlaase ea Aluminium core laminated koporo foil SinkPAD PCB

Thermoelectric Separation Substrate ke eng?

Likarolo tsa potoloho le pente ea mocheso holim'a substrate li arohane, 'me setsi sa mocheso sa likarolo tsa mocheso se kopana ka ho toba le mocheso o tsamaisang mocheso ho finyella phello e ntle ea mocheso oa mocheso (zero thermal resistance).Thepa ea substrate ka kakaretso ke tšepe (Koporo) substrate.

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Lintlha tsa Sehlahisoa

Lintlha tsa PCB

Mofuta oa PCB	SinkPAD II Technology
PCB boholo	50.0×60.0mm
Sebopeho	Maboto a selikalikoe
Mofuta oa Metal oa Motheo	Aluminium
Qetella Botenya	0.062 inch (1.57 mm)
Tsela e Otlolohileng ea Mocheso	EE
Thermal Conductivity	240.0 W/mK
Surface Finish	LF HASL
Glass Transition Temp.	170 likhato tsa Celsius
UL E amohetsoe	Ee
Ho latela RoHS	Ee