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Matla a Phahameng a Matla a Leseli la Sephethephethe sa LED PCB le Mabenkele a Lisebelisoa tsa Elektronike

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Boitsebiso ba Motheo: FR-4, FR2.Taconic, Rogers

Botenya ba Koporo: 1/2 oz min;12 oz max

Botenya ba Boto: 0.2mm-6.00 mm(8mil-126mil)

Min.Boholo ba lesoba: 0.1mm(4mil)

Min.Bophara ba Mola: 0.075mm(3mil)

Min.Sebaka sa Mohala: 0.1mm4mil)

Qetello ea Bokahohle: Khauta ea Ho qoelisoa / Au, HASL, OSP, joalo-joalo.

Warp & Twist: 0.7%

Sebaka sa lesoba: +/-0.075mm(3mil) CNC Drilling

Khanyetso ea Insulation: 10Kohm-20Mohm

Conductivity: <50ohm

Teko Voltage: 10-300V

Taolo ea ANCE: +/-10%

Phapang ea Boipheliso: +-/10%

Mamello ea Kemiso: +/-0.125mm(5mil) CNC Routing +/-0.15mm(6mil) ka ho Punching

Hole Diameter(H) PTH L: +/-0.075mm(3mil) NON-PTH L: +/-0.05mm(2mil)

Bophara ba Mokhanni(W): +/-20% ea litšoantšo tsa mantlha tsa PTH L: +/-0.

Litšebeletso tsa Rōna

Re ka fana ka tšebeletso e le 'ngoe:

1. PCB liboto oa potoloho.

2. Teko ea E.

3.Ho reka likarolo tsa elektronike.

4. Kopano ea PCB: e fumaneha ho SMT, BGA, DIP.

5. PCBA tshebetso teko.

6. Kopano e katlasehang.

Bokhoni ba sehlahisoa sa PCB

Bokhoni ba Tlhahiso ea PCB
Ntho	Tlhaloso
Lintho tse bonahalang	FR-4, FR1,FR2;CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminium Base, Copper Base,Ceramic, Crockery, joalo-joalo.
Litlhaloso	Tg CCL e Phahameng ea Fumaneha(Tg>=170℃)
Qetella Botenya ba Boto	0.2 mm-6.00mm(8mil-126mil)
Surface Finish	Monoana oa khauta(>=0.13um), Khauta e Kentsoeng(0.025-0075um), Khauta ea Plating(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)
Sebopeho	Ho tsamaisa, Punch, V-cut, Chamfer
Kalafo ea Bokaholimo	Solder Mask (e ntšo, e tala, e tšoeu, e khubelu, e putsoa, botenya> = 12um, Block, BGA)
	Silkscreen (e ntšo, e mosehla, e tšoeu)
	Letlapa le khonang-mask (e khubelu, e putsoa, botenya> = 300um)
Bonyane Core	0.075mm(3mil)
Botenya ba Koporo	1/2 oz min;12oz max
Min Trace Width & Line Spacing	0.075mm/0.075mm(3mil/3mil)
Min Hole Diameter bakeng sa ho Drilling ea CNC	0.1mm(4mil)
Min Hole Diameter bakeng sa Ho phunya	0.6mm(35mil)
Boholo bo boholo ba phanele	610mm * 508mm
Boemo ba lesoba	+/-0.075mm(3mil) CNC Drilling
Bophara ba Mokhanni(W)	+/-0.05mm(2mil) kapa +/-20% ea ea pele
Hole Diameter(H)	PTHL:+/-0.075mm(3mil)
Hole Diameter(H)	E seng PTHL:+/-0.05mm(2mil)
Hlalosa Mamello	+/-0.1mm(4mil) CNC Routing
Warp & Twist	0.70%
Khanyetso ea Insulation	10Kohm-20Mohm
Boikhantšo	<50 ohm
Teko ea Voltage	10-300V
Boholo ba Panel	110 x 100mm(mots)
Boholo ba Panel	660 x 600mm(boholo)
Boikemisetso bo fosahetseng ba lera	Mekhahlelo e 4:0.15mm(6mil)max
Boikemisetso bo fosahetseng ba lera	6 mealo:0.25mm(10mil)max
Sebaka se senyenyane pakeng tsa mokoti oa lesoba ho ea ho paterone ea potoloho ea lera le ka hare	0.25mm(10mil)
Sebaka se senyenyane pakeng tsa boto le paterone ea potoloho ea lera le ka hare	0.25mm(10mil)
Mamello ea botenya ba boto	4 mekhahlelo:+/-0.13mm(5mil)