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Lintlha tsa boto ea FR4

Likarolo tsa mantlha tsa botekgeniki tsa FR4 le ts'ebeliso: botsitso ba ts'ebetso ea ts'ebetso ea motlakase, botenya bo botle, bokaholimo bo boreleli, ha ho na likoting, mamello ea botenya ho feta maemo a tloaelehileng, e loketseng ts'ebeliso ea ts'ebetso e phahameng ea lisebelisoa tsa elektroniki tsa lihlahisoa, joalo ka poleiti ea matlafatso ea FPC, sebopi sa tin, mocheso o phahameng. letlapa le sa tsitsang, carbon diaphragm, lebili la naleli la ho sesa ka nepo, tlhahlobo ea PCB, poleiti ea motlakase (ea motlakase) (ea motlakase) ea sesebelisoa, poleiti ea ho kenya letsoho, likarolo tsa motlakase oa motlakase, boto ea li-coil terminal, boto ea elektroniki ea switch switch, jj.


Lintlha tsa Sehlahisoa

crc

 Lintlha tse mabapi le bokhoni ba ts'ebetso ea k'hamphani ea rona bakeng sa referense ea hau: 

 

Ntho Bokhoni ba ho Etsa
Lintho tse bonahalang FR-4 / Hi TG FR-4 / Lisebelisoa tsa mahala (ROHS Compliant) /CEM-3, Aluminium, Metal e thehiloeng
Lera No. 1-16
E felile Board botenya 0.2 mm-3.8mm'(8 milli-150 mil)
 
Mamello ea Botenya ba Boto ±10%
Botenya ba Cooper 0.5 OZ-11OZ (18 um-385 um)
Sekoti sa Koporo 18-40 dim
Taolo ea Impedans ±10%
Warp & Twist 0.70%
Peel ka khona 0.012″(0.3mm)-0.02'(0.5mm)
Litšoantšo
Min Trace Width (a) 0.1mm (4 mil)  
Min Space Width (b) 0.1mm (4 mil)
Min Annular Ring 0.1mm (4 mil)  
SMD Pitch (a) 0.2 limilimithara(8 mil)  
BGA Pitch (b) 0.2 limilimithara (8 mil)
   
Mask ea solder
Letamo la Mask la Min Solder (a) 0.0635 limilimithara (2.5mil)  
Ho hlakola mask a solder (b) 0.1mm (4 mil)
Sekheo se senyenyane sa SMT Pad (c) 0.1mm (4 mil)
Solder Mask Botenya 0.0007″(0.018mm)
Likoti
Min Hole size (CNC) 0.2 limilimithara (8 mil)
Min Punch Hole Size 0.9 limilimithara (35 mil)
Hole Size TOL (+/-) PTH: ±0.075mm;NPTH: ±0.05mm
Hole Position TOL ± 0.075mm
Ho roala
HASL 2.5um
Keta HASL mahala 2.5um
Khauta e Kentsoeng Nickel 3-7um Au:1-5u”
OSP 0.2-0.5um
Kemiso
Phanele Outline TOL (+/-) CNC: ± 0.125mm, Ho phunya: ± 0.15mm
Beveling 30°45°
Khauta monoana angle 15° 30° 45° 60°
Setifikeiti ROHS, ISO9001:2008, SGS, setifikeiti sa UL

 

Boholo 16x16 limilimithara
Botenya 1.6MM
phekolo ea holimo etella HASL mahala
mask a solder tšoeu
botenya ba koporo 1oz
led source CREE XML

Lintlha tsa boto ea FR4

Likarolo tsa mantlha tsa botekgeniki tsa FR4 le ts'ebeliso: botsitso ba ts'ebetso ea ts'ebetso ea motlakase, botenya bo botle, bokaholimo bo boreleli, ha ho na likoting, mamello ea botenya ho feta maemo a tloaelehileng, e loketseng ts'ebeliso ea ts'ebetso e phahameng ea lisebelisoa tsa elektroniki tsa lihlahisoa, joalo ka poleiti ea matlafatso ea FPC, sebopi sa tin, mocheso o phahameng. letlapa le sa tsitsang, carbon diaphragm, lebili la naleli la ho sesa ka nepo, tlhahlobo ea PCB, poleiti ea motlakase (ea motlakase) (ea motlakase) ea sesebelisoa, poleiti ea ho kenya letsoho, likarolo tsa motlakase oa motlakase, boto ea li-coil terminal, boto ea elektroniki ea switch switch, jj.

Litšobotsi tsa poleiti ea aluminium

1. Ho sebelisa theknoloji ea holim'a metsi (SMT)

2.Mokhatlong oa potoloho oa ho hasana ha mocheso ke phekolo e sebetsang haholo

3.Mocheso o tlaase oa ho sebetsa, ho ntlafatsa matla a matla le ho tšepahala, ho lelefatsa bophelo ba tšebeletso ea lihlahisoa;

4. Fokotsa boholo ba lihlahisoa tsa rona, fokotsa litšenyehelo tsa hardware le kopano

5.Ho e-na le li-substrates tsa brittle ceramic, mamello e ntle ea mochine

Aluminium plate SEBELISA: matla a hybrid IC (HTC)

1. Thepa ea molumo: : Amplifier ea ho kenya le ho tsoa, ​​amplifier e leka-lekaneng, amplifier ea molumo, preamplifier, amplifier ea matla, joalo-joalo.

2. Thepa ea matla : Switching regulator ` DC/AC converter ` SW regulator, joalo-joalo.

3. Thepa ea elektronike ea puisano: Keketseho e phahameng ea maqhubu `motlakase o sefang ` o fetisang potoloho.

4.Thepa ea othomathike ea Office : Li-motor drive, joalo-joalo.

5.Khomphutha : CPU board floppy drive sesebelisoa sa phepelo ea motlakase, jj.

Melao e qaqileng bakeng saPCBKopano

Tlhokahalo ea tekheniki:

1) Professional Surface-mounting and through-hole soldering Technology

2) Mefuta e fapaneng e kang 1206,0805,0603 likarolo tsa theknoloji ea SMT

3) Theknoloji ea ICT (In Circuit Test), FCT(Functional Circuit Test) theknoloji.

4) Theknoloji ea ho hlahisa khase ea naetrojene bakeng sa SMT.

5) Boemo bo phahameng ba SMT & Solder Assembly Line

6) Boima bo phahameng bo hokahaneng ba theknoloji ea ho bea boto.

re ka u etsetsa eng?

a) 1-16 lera FR-4 PCB boto, 1-2 lera Aluminium PCB.

b) botenya ba koporo ba 1-6 oz.

c) boholo ba lesoba la 0.2 mm.

d) 0.1 mm bophara ba mola/sebaka.

e) Moralo le sebopeho sa PCB.

f) Kopano, theko ea karolo.

PCBS ea rona e sebelisetsoa lihlahisoa tse ngata tsa elektroniki

Joalo ka lisebelisoa tsa bongaka, CCTV, phepelo ea motlakase, GPS, UPS, Set-top Box,

Telecommunication, LED, joalo-joalo.

Lihlahisoa tsa rona : 

PCB, MCPCB, FPC, Multi.lera PCB, Rigid flex PCB, LEDS(Edison, Cree)

Lipoleiti tsa aluminium tsa boleng bo holimo

Li-substrates tsa koporo

Li-substrates tsa tšepe

Li-substrates tsa ceramic

Lipoleiti tse Khethehileng - Rogers, polytetrafluoroethylene, TG high-frequency microwave circuit boards le liboto tsa potoloho tse tenyetsehang.

Sebelisa ho…

lebone la siling, lebone la letheba, lebone le tlase, lebone la moralo, lebone la pendant, lebone la ka hare, lebone la kichineng, lebone la pendant, lebone la ntloana, lebone la flash...

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