Directed conductivity thermal conductivity CREE XML Copper MCPCB printing circuit board 5050 LED PCB hand plate light
Lintlha tse mabapi le bokhoni ba ts'ebetso ea k'hamphani ea rona bakeng sa referense ea hau:
Ntho | Bokhoni ba ho Etsa | |
Lintho tse bonahalang | FR-4 / Hi TG FR-4 / Lisebelisoa tsa mahala (ROHS Compliant) /CEM-3, Aluminium, Metal e thehiloeng | |
Lera No. | 1-16 | |
E felile Board botenya | 0.2 mm-3.8mm'(8 milli-150 mil) | |
Mamello ea Botenya ba Boto | ±10% | |
Botenya ba Cooper | 0.5 OZ-11OZ (18 um-385 um) | |
Sekoti sa Koporo | 18-40 dim | |
Taolo ea Impedans | ±10% | |
Warp & Twist | 0.70% | |
Peel ka khona | 0.012″(0.3mm)-0.02'(0.5mm) | |
Litšoantšo | ||
Min Trace Width (a) | 0.1mm (4 mil) | |
Min Space Width (b) | 0.1mm (4 mil) | |
Min Annular Ring | 0.1mm (4 mil) | |
SMD Pitch (a) | 0.2 limilimithara(8 mil) | |
BGA Pitch (b) | 0.2 limilimithara (8 mil) | |
Mask ea solder | ||
Letamo la Mask la Min Solder (a) | 0.0635 limilimithara (2.5mil) | |
Ho hlakola mask a solder (b) | 0.1mm (4 mil) | |
Sekheo se senyenyane sa SMT Pad (c) | 0.1mm (4 mil) | |
Solder Mask Botenya | 0.0007″(0.018mm) | |
Likoti | ||
Min Hole size (CNC) | 0.2 limilimithara (8 mil) | |
Min Punch Hole Size | 0.9 limilimithara (35 mil) | |
Hole Size TOL (+/-) | PTH: ±0.075mm;NPTH: ±0.05mm | |
Hole Position TOL | ± 0.075mm | |
Ho roala | ||
HASL | 2.5um | |
Keta HASL mahala | 2.5um | |
Khauta e Kentsoeng | Nickel 3-7um Au:1-5u” | |
OSP | 0.2-0.5um | |
Kemiso | ||
Phanele Outline TOL (+/-) | CNC: ± 0.125mm, Ho phunya: ± 0.15mm | |
Beveling | 30°45° | |
Khauta monoana angle | 15° 30° 45° 60° | |
Setifikeiti | ROHS, ISO9001:2008, SGS, setifikeiti sa UL |
Boholo | 16x16 limilimithara |
Botenya | 1.6MM |
phekolo ea holimo | etella HASL mahala |
mask a solder | tšoeu |
botenya ba koporo | 1oz |
led source | CREE XML |
Lintlha tsa boto ea FR4
Likarolo tsa mantlha tsa botekgeniki tsa FR4 le ts'ebeliso: botsitso ba ts'ebetso ea ts'ebetso ea motlakase, botenya bo botle, bokaholimo bo boreleli, ha ho na likoting, mamello ea botenya ho feta maemo a tloaelehileng, e loketseng ts'ebeliso ea ts'ebetso e phahameng ea lisebelisoa tsa elektroniki tsa lihlahisoa, joalo ka poleiti ea matlafatso ea FPC, sebopi sa tin, mocheso o phahameng. letlapa le sa tsitsang, carbon diaphragm, lebili la naleli la ho sesa ka nepo, tlhahlobo ea PCB, poleiti ea motlakase (ea motlakase) (ea motlakase) ea sesebelisoa, poleiti ea ho kenya letsoho, likarolo tsa motlakase oa motlakase, boto ea li-coil terminal, boto ea elektroniki ea switch switch, jj.
Litšobotsi tsa poleiti ea aluminium
1. Ho sebelisa theknoloji ea holim'a metsi (SMT)
2.Mokhatlong oa potoloho oa ho hasana ha mocheso ke phekolo e sebetsang haholo
3.Mocheso o tlaase oa ho sebetsa, ho ntlafatsa matla a matla le ho tšepahala, ho lelefatsa bophelo ba tšebeletso ea lihlahisoa;
4. Fokotsa boholo ba lihlahisoa tsa rona, fokotsa litšenyehelo tsa hardware le kopano
5.Ho e-na le li-substrates tsa brittle ceramic, mamello e ntle ea mochine
Aluminium plate SEBELISA: matla a hybrid IC (HTC)
1. Thepa ea molumo: : Amplifier ea ho kenya le ho tsoa, amplifier e leka-lekaneng, amplifier ea molumo, preamplifier, amplifier ea matla, joalo-joalo.
2. Thepa ea matla : Switching regulator ` DC/AC converter ` SW regulator, joalo-joalo.
3. Thepa ea elektronike ea puisano: Keketseho e phahameng ea maqhubu `motlakase o sefang ` o fetisang potoloho.
4.Thepa ea othomathike ea Office : Li-motor drive, joalo-joalo.
5.Khomphutha : CPU board floppy drive sesebelisoa sa phepelo ea motlakase, jj.
Melao e qaqileng bakeng saPCBKopano
Tlhokahalo ea tekheniki:
1) Professional Surface-mounting and through-hole soldering Technology
2) Mefuta e fapaneng e kang 1206,0805,0603 likarolo tsa theknoloji ea SMT
3) Theknoloji ea ICT (In Circuit Test), FCT(Functional Circuit Test) theknoloji.
4) Theknoloji ea ho hlahisa khase ea naetrojene bakeng sa SMT.
5) Boemo bo phahameng ba SMT & Solder Assembly Line
6) Boima bo phahameng bo hokahaneng ba theknoloji ea ho bea boto.
re ka u etsetsa eng?
a) 1-16 lera FR-4 PCB boto, 1-2 lera Aluminium PCB.
b) botenya ba koporo ba 1-6 oz.
c) boholo ba lesoba la 0.2 mm.
d) 0.1 mm bophara ba mola/sebaka.
e) Moralo le sebopeho sa PCB.
f) Kopano, theko ea karolo.
PCBS ea rona e sebelisetsoa lihlahisoa tse ngata tsa elektroniki
Joalo ka lisebelisoa tsa bongaka, CCTV, phepelo ea motlakase, GPS, UPS, Set-top Box,
Telecommunication, LED, joalo-joalo.
Lihlahisoa tsa rona :
PCB, MCPCB, FPC, Multi.lera PCB, Rigid flex PCB, LEDS(Edison, Cree)
Lipoleiti tsa aluminium tsa boleng bo holimo
Li-substrates tsa koporo
Li-substrates tsa tšepe
Li-substrates tsa ceramic
Lipoleiti tse Khethehileng - Rogers, polytetrafluoroethylene, TG high-frequency microwave circuit boards le liboto tsa potoloho tse tenyetsehang.
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