Ka ho toba mogote tseleng MCPCB le teba-sebaka MCPCB, Koporo Core PCB, Koporo PCB

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Product Qaqileng

Lintlha tsa Sehlahisoa

Base Boitsebiso: Alu / koporo

Botenya ba Koporo: 0.5 / 1 / 2/3/4 OZ

Botenya ba Boto: 0.6-5mm

Min. Hole bophara: T / 2mm

Min. Bophara ba Line: 0.15mm

Min. Sebaka sa Line: 0.15mm

Holim 'a qete: HASL, qoelisoa khauta, Flash khauta, tlotsitsoe silevera, OSP

Lebitso la eona: MCPCB LED PCB e hatisitsoeng boto ea potoloho, Aluminium PCB, konokono ea koporo 

PCB

V-khaola Angle: 30 °, 45 °, 60 °

Sebopeho mamello: +/- 0.1mm

Hole DIA mamello: +/- 0.1mm

Ts'ebetso ea Thermal: 0.8-3 W / MK

Motlakase oa E-test: 50-250V

Matla a ho tlosa: 2.2N / mm

Warp or twist:</=0.5%

PTH Wall botenya:> 0.025mm

Che. Lintho Index
1 Phekolo ea bokaholimo  HASL, Khauta qoelisoa, Flash khauta, tlotsitsoe silevera, OSP
 2 Lera Lehlakore le le leng
 3 PCB botenya 0.6-5mm
 4 Boloetse ba Koporo ea Foil 0.5-4Oz
 5 Mets lesoba bophara T / 2mm
 6 Mets Line bophara 0.15mm
 7 Lera Dikarolo 1-4
 8 Boholo ba boto ea Max 585mm * 1185mm
 9 Min boto boholo 3mm * 10mm
 10 Botenya ba boto 0.4-6.0mm
 11 Sebaka se senyane 0.127mm
 12  Botenya ba lebota la PTH  > 0.025mm
 13  V-khaola  30/45/60 lengolo la
 14  V-khaola boholo  5mm * 1200mm
 15  Mokotlana oa mokotla  0.35mm

Nyehelo: MCPCB ea lehlakore le le leng, MCPCB e nang le mahlakore a mabeli, MCPCB e habeli, MCPCB e kobehang, phapanyetsano e futhumetseng ea MCPCB, eutectic bonding flip -chip MCPCB. MCPCB rona e customized.

1.aluminum base PCB LED light led led light module led

2.aluminum substrate PCB

3.aluminum base koporo-apere laminate PCB

4.aluminum botlaaseng PCB

1) lintho tse bonahalang: FR-4, Koporo, Aluminium e thehiloeng 

2) lera: 1-4

3) botenya ba koporo: 0.5oz, 1.0oz, 2oz, 3oz, 4oz

4) holim fihlela qetellong: HASL, OSP, qoelisoa Khauta, qoelisoa silevera, Flash khauta, tlotsitsoe silevera.

5) mmala oa mask oa solder: Botala, botšo, bosoeu

6) V-sehiloeng angle: 30, 45,60 lengolo la 

7) E-test voltage: 50-250V 

8) Setifikeiti: UL, ISO9001, ROHS, SGS, CE

MC PCB Technical bokgoni

;Tlanya Ntho Bokgoni Tlanya Ntho Bokgoni
Lera / 1-4 Boholo ba lesoba Ho cheka boholo ba lesoba 0.6-6.0mm
Laminate Mofuta oa Laminate Aluminium, tšepe le koporo e ka itšehla thajana   Mamello Hole ± 0.05mm
  Teba 1000 * 1200mm 60081500mm   Ho mamella boemo ba lesoba ± 0.1mm
  Botenya ba boto 0.4mm-3.0mm   Karolelano ea likarolo 5: 1
  Mamello ea boto botenya ± 0.1mm Masekete a Solder Motsoako oa solder 4mil
  Botenya ba dielectric 0.075-0.15mm Ho hloka thuso Mamello mamello ± 10%
Potoloho Bonyane ba sebaka / sebaka 5mil / 5mil Matla a letlalo 1.5 N / limilimithara
  Mamello ea bophara / sebaka ± 15% Ho hanyetsa bokaholimo *1 * 105M
Botenya ba koporo Ka hare le kantle 0.5-10 OZ   *1 * 106M
      Moqolotsi oa moqolo  
Thermal conductivity Mocheso o tlase oa mocheso 1.0-1.5
  Mocheso o bohareng oa mocheso 1.5-1.8
  Khoebo e phahameng ea 2.0-8.0
Fioat ea Solder 260 ℃, 10mil, Ha ho na blister, Ha ho na boikemisetso
Ho lumelloa 44.4
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