Tsela e tobileng ea mocheso MCPCB le Sink-pad MCPCB, Copper Core PCB, Copper PCB
Lintlha tsa Sehlahisoa
Boitsebiso ba motheo:Alu/ koporo
Botenya ba Koporo:0.5/1/2/3/4 OZ
Botenya ba Boto: 0.6-5mm
Min.Bophara ba lesoba: T/2mm
Min.Bophara ba Mola: 0.15mm
Min.Sebaka sa Mohala: 0.15mm
Qetello ea Bokahohle: HASL, khauta e qoelisoang, khauta e phatsimang, silevera e pentiloeng, OSP
Lebitso la ntho: MCPCB LED PCB Boto e hatisitsoeng ea potoloho, Aluminium PCB, motheo oa koporo
PCB
V-cut Angle:30°,45°,60°
Mamello ea sebopeho: +/-0.1mm
Mamello ea lesoba DIA:+/-0.1mm
Thermal conductivity: 0.8-3 W / MK
E-test voltage: 50-250V
Matla a ho khaola: 2.2N / mm
Warp kapa sotha:
PTH Wall botenya:> 0.025mm
Che. | Lintho | Index |
1 | Kalafo ea Bokaholimo | HASL, khauta e qoelisoang, khauta e phatsimang, silevera e pentiloeng, OSP |
2 | Lera | Lehlakore le le leng |
3 | Botenya ba PCB | 0.6-5 limilimithara |
4 | Boloetse ba Koporo ea Foil | 0.5-4Oz |
5 | Min lesoba bophara | T/2mm |
6 | Min Line bophara | 0.15 limilimithara |
7 | Mekhahlelo | 1-4 mekhahlelo |
8 | Boholo ba boto ea boholo | 585mm * 1185mm |
9 | Boto e nyane ea boholo | 3mm*10mm |
10 | Botenya ba boto | 0.4-6.0mm |
11 | Sebaka se senyenyane | 0.127 limilimithara |
12 | PTH botenya ba lebota | > 0.025 limilimithara |
13 | V-cut | 30/45/60 likhato |
14 | Boholo ba V-cut | 5mm * 1200mm |
15 | Min.bag pad | 0.35 limilimithara |
Tlhahiso: MCPCB e lehlakoreng le le leng, MCPCB e mahlakoreng a mabeli, MCPCB e habeli, MCPCB e kobehang, MCPCB ea phapanyetsano ea mocheso e tobileng, eutectic bonding flip -chip MCPCB.MCPCB ea rona e hlophisitsoe.
1.aluminium base PCB LED leseli led lebone la mojule led
2.aluminium substrate PCB
3.aluminium base ea koporo-clad laminate PCB
4.aluminium base PCB
1) lintho tse bonahalang: FR-4, Koporo, Aluminium e thehiloeng
2) lera: 1-4
3) botenya ba koporo: 0.5oz, 1.0oz, 2oz, 3oz, 4oz
4) pheletso ea bokaholimo: HASL, OSP, Khauta e Kentsoeng, Silevera ea ho qoelisoa, khauta ea Flash, silevera e pentiloeng.
5) 'mala oa mask oa solder: o motala, o motšo, o mosoeu.
6) V-cut angle: 30, 45,60 degree
7) E-test voltage: 50-250V
8) Setifikeiti: UL, ISO9001, ROHS, SGS,CE
MC PCB Bokhoni ba Tekheniki
;Mofuta | Ntho | Bokhoni | Mofuta | Ntho | Bokhoni |
Mekhahlelo | / | 1-4 | Boholo ba lesoba | Boholo ba lesoba la ho phunya | 0.6-6.0mm |
Laminate | Mofuta oa laminate | Aluminium, tšepe, le koporo e itšehla thajana | Ho mamellana le lesoba | ± 0.05 limilimithara | |
Boemo | 1000 * 1200mm 60081500mm | Ho mamella boemo ba lesoba | ±0.1mm | ||
Botenya ba boto | 0.4mm-3.0mm | Aspect ratio | 5:1 | ||
Ho mamella botenya ba boto | ±0.1mm | Mask ea solder | Min solder borokho | 4 mil | |
Botenya ba dielectric | 0.075-0.15mm | Tšitiso | Mamello ea impedance | ±10% | |
Potoloho | Min wide/ sebaka | 5mil/5mil | Matla a peel | ≥1.8 N/mm | |
Mamello ya bophara/ sebaka | ±15% | Ho hanyetsa bokahodimo | ≥1*105M | ||
Botenya ba koporo | Ka hare le kantle | 0.5-10 OZ | ≥1*106M | ||
Ho hanyetsa molumo | |||||
Thermal conductivity | Mocheso o tlaase conductivity 1.0-1.5 | ||||
Bohareng ba mocheso conductivity 1.5-1.8 | |||||
High conductivity 2.0-8.0 | |||||
Solder fioat | 260 ℃, 10mil, Ha ho blister, Ha ho boikemisetso | ||||
Tumello | ≤4.4 |