4 Layer PCB Manufacturing Prototype Theko e tlase Moetsi oa PCB naheng ea China
Lintlha tsa Sehlahisoa
Kopo: Elektronike, sesole, meriana, joalo-joalo
Setifikeiti: ISO/TS16949/ROHS/TS16949
'Mala oa mask oa solder: Green Black Blue White
Palo ea Lera:1-22 Layer
Tšebeletso: Moenjineri ea profeshenale, e ntle ka mor'a ts'ebeletso, theko ea tlholisano
PCB Standard:IPC-A-610 D/IPC-III Standard
Mamello ea lesoba:PTH: ±2mil, NTPH: ±2mil
Mamello ea Boto ea Boto: ± 10%
Litšebeletso tsa OEM/ODM: | |||
Mekhahlelo | 1-22 mekhahlelo | Min.bophara ba mola | 2 mil |
Max.board size (e le 'ngoe&habelilehlakore) | 700 * 1200mm | Min.annular ring bophara: visa | 3 mil |
Qetello ea bokaholimo | HAL (e nang le Pb mahala), e kentsoeng Ni/Au,Silivera ea ho qoelisoa, IMM Ni/Au, I MM Sn,khauta e thata, OSP, joalo-joalo | Min.board botenya(multilayer) | 4 lera:0.4mm;6 mealo: 0.6mm;8 mealo: 1mm; 10 mealo: 1.2mm |
Lisebelisoa tsa boto | FR-4;TG e phahameng;CTI e phahameng;halogen mahala;maqhubu a phahameng (rogers, ta-conic,PTFE,nelson,ISOLA,polyclinic 370 HR);koporo e teteaneng | Botenya ba ho pola (Technique:Ho qoelisoa Ni/Au) | Mofuta oa ho pola: IMM Ni, Min./Max botenya:100/150U” Mofuta oa ho pola: IMM Au, Min./Max thickness:2/4U” |
Taolo ea impedance | ± 10% | Sebaka pakeng tsamola ho isa pheletsong ea boto | Tlhaloso: 0.2mm V-CUT: 0.4mm |
Botenya ba koporo ea motheo (Innerle bokantle) | Min.botenya:1/3 OZ Max.botenya:6OZ | Min.hole size(botenya ba boto ≥2mm) | Aspect ratio≤16 |
E qetile botenya ba koporo | Mekhahlelo ea kantle:botenya bo fokolang 1 OZ,Max.thickness 10 OZ Mekhahlelo e ka hare: Botenya bo fokolang 0.5OZ, Max.thickness 6 OZ | Botenya ba Max.board(lehlakore le le leng&habeli) | 6mm |
Ngola molaetsa wa hao mona mme o re romele wona